TG-X Ultra Soft Thermal Conductive Pad

TG-X is high performance silicone gap filler with a thermal conductivity of 12 W/mk. TG-X is highly conformable and can be supplied in either standard sheets or custom die-cut parts. TG-X is formulated to wet most surfaces and provide low thermal impedance for the most demanding of applications.
FEATURES
High-end product with thermal conductivity of 12 W/mK
Highly compressible
Naturally tacky
Low Shore 00 hardness
Low oil bleed
Electrically insulating
APPLICATIONS
Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink
LCD, TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.