H48-2 Thermal Conductive Pad

H48-2 is a silicone based thermal pad which has been designed for both efficient heat transfer away from critical devices and ease of manufacture. H48-2 can be provided in a range of formats and thicknesses, such as standard sheets, rolls or die cuts. Additionally, H48-2 may be provided with either one of two sided adhesive to further facilitate manufacturing processes.
FEATURES
Good thermal conductivity
Ultra-soft and high compressibility
Natural tack
Easy to assemble
Good insulator
Shock and vibration absorber
APPLICATIONS
Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink LCD, TV, Notebook PC, PC Telecom Device, Wireless, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.