H48-2K Thermal Conductive Pad

H48-2K is an ultra thin, silicon based gap filler which is designed for applications which require a high dielectric breakdown voltage combined with ultra low silicone outgassing. H48-2K is available in various formats such as standard sheets or custom die cuts to support both prototyping and high volume manufacturing.
FEATURES
Good thermal conductivity
Ultra-soft and high compressibility
Natural tack
Easy to assemble
Good insulator
Shock and vibration absorber
APPLICATIONS
Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink LCD, TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.