TG-S606 Thermal Compound

TG-S606 is a silicone based thermal grease that has been designed for high performance CPUs and similar applications. It has a thermal conductivity of 3.6 W/mK, superior wetting characteristics, resulting in a very low thermal resistance and excellent long term reliability.
FEATURES
Good thermal conductivity
Easy to assemble
High stability
Does not harden with time
APPLICATIONS
Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink
LCD TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.