BERGQUIST® GAP PAD® TGP 800VO

BERGQUIST GAP PAD TGP 800VO (Highly Conformable, Thermally Conductive Material for Filling Air Gaps) is a cost-effective, thermally conductive interface material. The material is a filled, thermally conductive polymer supplied on a rubber-coated fiberglass carrier allowing for easy material handling. The conformable nature of BERGQUIST® GAP PAD® TGP 800VO allows the pad to fill in air gaps between PC boards and heat sinks or a metal chassis.
FEATURES:
Thermal conductivity: 0.8 W/m-K
Enhanced puncture, shear and tear resistance
Conformable gap filling material
Electrically isolating
APPLICATIONS:
Telecommunications
Computers and peripherals
Power conversion
Between heat-generating semiconductors and a heat sink
Areas where heat needs to be transferred to a frame, chassis, or other type of heat spreader
Between heat-generating magnetic components and a heat sink