BERGQUIST® GAP PAD® TGP 800VOS

BERGQUIST GAP PAD TGP 800VOS is recommended for applications that require a minimum amount of pressure on components. BERGQUIST GAP PAD TGP 800VOS is a highly conformable, low-modulus, filled-silicone polymer on a rubber-coated fiberglass carrier. The material can be used as an interface where one side is in contact with a leaded device.
FEATURES:
Thermal conductivity: 0.8 W/m-K
Conformable, low hardness
Enhanced puncture, shear and tear resistance
Electrically isolating
APPLICATIONS:
Telecommunications
Computers and peripherals
Power conversion
Between heat-generating semiconductors or magnetic components and a heat sink
Areas where heat needs to be transferred to a frame, chassis, or other type of heat spreader