BERGQUIST® GAP PAD® TGP 3004SF

BERGQUIST® GAP PAD® TGP 3004SF is a high-performance, 3.0 W/m-K, thermally conductive gap filling material. BERGQUIST® GAP PAD® TGP 3004SF is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. It is designed for applications that are silicone-sensitive. BERGQUIST® GAP PAD® TGP 3004SF is constructed using a 0.25-mils PET film that provides a no tack surface on one side and natural tack on the other side.
FEATURES:
Thermal Conductivity: 3.0 W/m-K
Silicone-free formulation
0.25-mil PET provides easy disassembly, leaving no residue
Tacky side allows for ease of handling and placement
APPLICATIONS:
Hard disk drives
HDD case to tray
HDD/SSD combination drives
Automotive electronics
Medical devices
Solar energy
Optical components
LED lighting
Laser optics