BERGQUIST® GAP PAD® TGP 2000SF

BERGQUIST® GAP PAD® TGP 2000SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stack-up tolerances. BERGQUIST® GAP PAD® TGP 2000SF is reinforced for easy material handling and added durability during assembly. The material is available with a protective liner on both sides. BERGQUIST® GAP PAD® TGP 2000SF is supplied with reduced tack on one side, allowing for burn-in processes and easy rework.
FEATURES:
Thermal conductivity: 2.0 W/m-K
Silicone-free formulation
Medium compliance with easy handling
Electrically isolating
APPLICATIONS:
Digital disk drives
Proximity near electrical contacts (e.g., DC brush motors, connectors, relays)
Fiber optics modules