BERGQUIST® GAP PAD® TGP 1300

BERGQUIST® GAP PAD® TGP 1300 is a highly compliant GAP PAD® material that is ideal for fragile component leads. The material is fiberglass-reinforced for improved puncture resistance and handling characteristics. BERGQUIST® GAP PAD® TGP 1300 maintains a conformable, yet elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography. BERGQUIST® GAP PAD® TGP 1300 features an inherent tack on both sides of the material, eliminating the need for thermally impeding adhesive layers.
FEATURES:
Thermal conductivity: 1.3 W/m-K
Highly conformable/low hardness
Decreased strain on fragile components
Fiberglass-reinforced for puncture, shear and tear resistance
Quick rebound to original shape
APPLICATIONS:
Between any heat-generating component and a heat sink
Computers and peripherals
Telecommunications
Between any heat-generating semiconductor and a heat sink
Shielding devices