BERGQUIST® GAP PAD® TGP 1000VOUS

Ultra-Conformable, Thermally Conductive Material for Filling Air Gaps
BERGQUIST GAP PAD TGP 1000VOUS is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature
of the material also gives excellent low stress vibration dampening and shock absorbing characteristics. BERGQUIST GAP PAD TGP 1000VOUS is an
electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high voltage, bare-leaded devices.
FEATURES:
Thermal conductivity: 1.0 W/m-K
Highly conformable, low hardness
“Gel-like” modulus
Decreased strain
Puncture-, shear- and tear-resistant
Electrically isolating
APPLICATIONS:
Telecommunications
Computers and peripherals
Power conversion
Between heat-generating semiconductors or magnetic components and a heat sink
Areas where heat needs to be transferred to a frame, chassis, or other type of heat spreader