t-Global Ultra Soft Thermal Pad TG-A6200

By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
FEATURES:
High thermal conductivity
High compressibility and compliancy
Natural tack
APPLICATIONS:
Best for high power applications
Electronic components: IC, CPU, MOS, LED, Mother Board, Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless
Hub, DDR ll Module, DVD Applications, Handset applications, etc.