t-Global Ultra Soft Thermal Pad TG-A1250

By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
FEATURES:
High thermal conductivity up to 12.5 W/mK
Low thermal resistance
High compressibility and compliancy
Electrical insulation
APPLICATION:
Best for high power applications
Electronic components: IC, CPU, MOS, LED,
Motherboard, Power Supply, Heat Sink, LCD-TV
Notebook, PC, Telecom Device, Wireless Hub,
DDR ll Module, DVD Applications, Handset applications, etc.