L37-5S Thermal Conductive Pad

L37-5S is an ultra-soft silicone based thermal pad which is designed to provide a highly compressible thermal interface with high dielectric breakdown and low thermal impedance. L37-5S can also be provided with one or two sided thermally conductive adhesive for ease of manufacture.
FEATURES
Very good thermal conductivity
Soft and high compressibility
Natural tack
Easy to assemble
Good insulator
APPLICATIONS
Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink
LCD TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.