L37-3 Thermal Conductive Pad

L37-3 is a silicone based thermal interface pad which offers a good combination of high dielectric breakdown voltage, compliance and low thermal impedance. It contains a fibreglass mesh for enhanced ease of manufacture and is available in various formats such as standard sheets, log-rolls and custom die cut parts. L37-3 is available in a range of thicknesses and with one or two side thermally conductive adhesive pre-applied.
FEATURES
Base materials are silicone with fibreglass
One side with natural tack and another side with smooth surface
Won’t be deformed when being pulled
High dielectric breakdown voltage
APPLICATIONS
Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink
LCD TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.