JONES Thermal PAD 21-250-100-0816

JONES Thermal Pad 21-250 is designed to provide excellent performance and adhesion or natural tack.It demonstrates highly conformable to uneven and rough surfaces with minimal thermal gap filler compression. JONES Thermal Pad 21-250 is available in custom die-cut parts, sheets and rolls, which makes it easy handling and simplified application. It’s also available in a variety of thicknesses and hardness.
FEATURE
Thermal Conductivity :5.0W/m·K
Extremely Good Thermal Performance
Very Good Compressibility
High Breakdown Voltage
Easy For Installation
APPLICATION
Memory Modules
Mass Storage Devices
Automotive Electronics
Telecommunication Hardware
Radios
Power Electronics