JONES Thermal PAD 21-233-SP01-300-0132

JONES Thermal Pad 21-233-SP01 is designed to provide good thermal performance and adhesion or natural tack.It demonstrates highly conformable to uneven and rough surfaces with minimal thermal gap filler compression. JONES Thermal Pad 21-233-SP01 is available in custom die-cut parts, sheets and rolls, which makes it easy handling and simplified application. It’s also available in a variety of thicknesses and hardness.
FEATURE
Thermal Conductivity :3.0W/m·K
Single-Side Sticky
Very Good Thermal Performance
Good Compressibility and Elasticity
Tiny Outgassing
Easy For Installation
APPLICATION
Memory Modules
Mass Storage Devices
Automotive Electronics
Telecommunication Hardware
Radios
Power Electronics
Smartphone Industry