JONES 21-340-SP01 Single Part Thermal Gel

JONES Thermal Gel 21-340-SP01 is a soft, single part, silicone putty thermal gap filler in which no cure is required. This gap filler is designed to be used in where large gap tolerances presently and low mechanical stress on delicate components . It is ideal for filling variable gaps between multiple components and a common heat sink.
FEATURES AND BENEFITS
Thermal Conductivity: 3.5 W/m-K｜Soft and Compliant Transferring Little To No Pressure Between Interfaces｜Pre-Cured｜Electrically Isolating｜Low Thermal Resistance｜Easily DispensableRegulatory｜
APPLICATIONS
Cooling components to chassis, frame, or other mating components｜Memory modules｜Mass storage devices｜Automotive electronics｜ Telecommunication hardware｜Power electronics｜LCD and PDP Gat panel｜Audio and video component｜IT infrastructure｜GPS navigation and other portable devices.