Dual-Cure 9101

Dual-Cure 9101 light/moisture-cure encapsulant is an improved, resilient, chip-encapsulating material designed with a UV/Visible light and secondary ambient moisture-cure system, making it ideal for encapsulation applications where shadowed areas are present. 9101 encapsulating material is specially formulated to cure in shadowed areas over time with ambient moisture.
FEATURES:
UV/Visible light cure
Secondary moisture cure
Flexible encapsulant
Shadowed area performance
Moisture and thermal resistance
APPLICATIONS:
Chip on board
Chip on flex
Chip on glass
Wire bonding