TIA2101GF 2K Thermally Conductive Gap Filler

Momentive’s thermally conductive gap fillers are non-slumping, dispensable materials that can be applied to gaps to create a heat path. These non-adhesive curing type TIMs form a soft, stress-absorbing thermal interface. In addition to filling gaps in electronic components, they are also applied to flat or high-profile 3-dimensional surfaces as a cured-in-place thermal pad or as a pump-out resistant alternative to greases.
FEATURES:
High thermal conductivity (10.1 W/m.K)
Dispensable formulation that conforms to complex shapes.
Soft, stress-absorbing
Electrically insulative
Repairable
Ability to remain in place under thermal cycling scenarios
✓ No-sag
✓ No crack
✓ No voiding