Thermal PAD 21-881-250-0660

JONES Thermal Pad 21-881 is an ultra soft putty like gap filling material rated at a thermal conductivity of 8.0 W/m-K. It is conformable to uneven and rough surfaces, where require excellent compressibility to the thermal gap filler.Its soft construction offers high conformability and imparts minimum pressure to electronic components.
FEATURE
Thermal Conductivity :8.0W/m·K
Ultra Soft (Putty Like)
Extremely Good Thermal Performance
Excellent Surface Wetting
High Breakdown Voltage
Easy For Installation
APPLICATION
Memory Modules
Mass Storage Devices
Automotive Electronics
Telecommunication Hardware
Radios
Audio And Video Players
IT Infrastructure