Mỡ công nghiệp
Dầu công nghiệp
Keo công nghiệp
Máy văn phòng – Linh kiện
Thiết bị mã vạch
Vật tư đóng gói
Vật tư phòng sạch
Màng cuốn,băng dính công nghiệp
Công nghệ RFID,thiết bị mã hóa
Hóa chất công nghiệp
Bảo hộ lao động
Công cụ – Dụng cụ
Linh kiện khác
Multi-Cure 9001-E-v3.1 encapsulant cures in seconds to enhance moisture, thermal cycle, and abrasion resistance of electronic and microelectronic assemblies. This material offers adhesion to various component substrates. This encapsulant provides optimal coverage over difficult circuit geometries. 9001-E-v3.1 encapsulating material has high ionic purity, is solvent free, and isocyanate free. This encapsulant has been engineered to have a low modulus and low Tg to minimize stress on delicate wire bonds. Material exposed to light will cure in seconds, while any shadowed areas will cure upon heat exposure. 9001-E-v3.1 Visible/UV light-curable encapsulant is formulated for fast on-demand cure with the Dymax BlueWave® LED Prime UVA spot curing lamp and BlueWave® LED DX-1000 curing system.
Multi-Cure 9001-E-v3.1 encapsulant is especially well suited for chip-on-board, chip-on-flex, multi-chip modules and wire bonding.
APPLICATIONS:
Chip-on-board
Chip-on-flex
Chip-on glass
Wire bonding
Bare-die encapsulation
Multi-Cure 9001-E-V3.1
Enhance the durability of electronic and microelectronic assemblies with Multi-Cure 9001-E-v3.1 encapsulant. Curing in seconds, it boosts moisture, thermal cycle, and abrasion resistance. With excellent adhesion to different substrates and optimal coverage over complex circuit geometries, this material provides reliable protection for sensitive components.
Danh mục: Dymax
Sản phẩm tương tự
Dymax
