JONES Thermal Gel 21-361-SP02

JONES Thermal Gel 21-361-SP02 is a soft, single part, silicone putty thermal gap filler in which no cure is required. This gap filler is designed to be used in where large gap tolerances are present and low mechanical stress on delicate components are needed. It is ideal for filling variable gaps between multiple components and a common heat sink. JONES Thermal Gel 21-361-SP02 has a composition which yields superior thermal performance and super compliancy. This material transfers little to no pressure between interfaces. Specialized rheology allows for easy flow under pressure.
FEATURE
Thermal Conductivity: 6.0 W/m-K
High Reliability
Easily Dispensable
Pre-Cured
Electrically Isolating
Low Thermal Resistance
APPLICATION
Cooling components to chassis, frame, or other mating components
Memory modules
Mass storage devices
Automotive electronics
Telecommunication hardware
Power electronics
LCD and PDP flat panel
Audio and video component
IT infrastructure
GPS navigation and other portable devices