JONES Thermal Gel 21-335D

JONES Thermal Gel 21-335D is a two-part dispensable materials compounded with thermal conductive fillers and silicone matrix. It demonstrates high thermal conductivity,good thermal performance and high reliability. In addition to providing variable gap adaption, it will impart little and reduced stress on components during assembly. JONES Thermal Gel 21-335D is ideal for applications that require a higher flow rate and easy reworking.
FEATURE
Thermal Conductivity :3.5W/m·K
Minimal stress imparted to components during assembly
Easy for rework
Easily dispensable
Cured at room Temperature
Electrically Isolating
Low Thermal Resistance
High Reliability
APPLICATION
Cooling components to chassis, frame, or other mating component
Home & Small Office Network
Mass Storage Devices
Automotive Electronics
Telecommunication Hardware
LED Solid State Lighting
Power Electronics