JC 823-6 Epoxy for BGA-CSP Under-fill

This product is a one component epoxy and can rework adhesive for electronic devices bonding. This product is easy to operate and suited for various applications of electronic components, such as potting, casting and sealing. This resin can be fast cured at high temperature, is able to reduce the working time and increase the efficiency at the same time. This product develops tough, strong, structural bonds which provide excellent shear,peel and impact strength. The durability of this resin is very high levels and this resin can pass many environmental test experiments. When underfilling CSP and BGA chips, it can buffer the expansion and contraction stress of the solder ball contacts, and can buffer the shear force conducted by the reaction force during the drop test.
Features
1. This product is solvent-free, no volatile materials and will not release any toxic volatilizations.
2. This product is low viscosity and excellent fluidity.
3. The hardening surface will not exhibit a surface oiliness and poor gloss.
4. The reactivity of this product is good at the temperature higher than 150 oC.
5. This resin excels where high rebound, fatigue and crack resistance is critical.
6. This product complies to the 2011/65/EU RoHS regulations.
7. This product complies to chlorine < 900ppm, bromine < 900ppm, chlorine + bromine < 1500ppm