BERGQUIST® GAP PAD® TGP HC1000

BERGQUIST® GAP PAD® TGP HC1000 is an extremely conformable, lowmodulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. BERGQUIST® GAP PAD® TGP HC1000 is offered with removable protective liners on both sides of the material.
FEATURES:
Thermal conductivity: 1.0 W/m-K
Highly conformable, low hardness
“Gel-like” modulus
Fiberglass-reinforced for puncture, shear and tear resistance
APPLICATIONS:
Computers and peripherals
Telecommunications
Heat interfaces to frames, chassis, or other heat spreading devices
Memory modules and chip scale packages
CD-ROM and DVD cooling
Areas where irregular surfaces need to make a thermal interface to a heat sink
DDR SDRAM memory modules
FB-DIMM modules