BERGQUIST® GAP PAD® TGP A2600

BERGQUIST® GAP PAD® TGP A2600 is a thermally conductive, filled-polymer laminate, supplied on a reinforcing mesh for added electrical isolation, easy material handling and enhanced puncture, shear and tear resistance. BERGQUIST® GAP PAD® TGP A2600 has a reinforcement layer on the dark gold side of the material that assists in burn-in and rework processes while the light gold and soft side of the material allows for added compliance.
FEATURES:
Thermal conductivity: 2.6 W/m-K
Fiberglass-reinforced for puncture, shear and tear resistance
Reduced tack on one side to aid in application assembly
Electrically isolating
APPLICATIONS:
Computers and peripherals
Heat pipe assemblies
CD-ROM and DVD cooling
Areas where heat needs to be transferred to a frame, chassis or other type of heat spreader
Telecommunications
Memory modules
Between CPU and heat spreader