BERGQUIST® GAP PAD® TGP 2000 (GAP PAD® 2000S40)

BERGQUIST® GAP PAD® TGP 2000 is recommended for low-stress applications that require a mid- to high-thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances.
BERGQUIST® GAP PAD® TGP 2000 is offered with inherent natural tack on both sides of the material allowing for stick-in-place characteristics during application assembly. The material is supplied with protective liners on both sides. The top side has reduced tack for ease of handling.
FEATURES:
Thermal conductivity: 2.0 W/m-K
Low “S-Class” thermal resistance at very low pressures
Highly conformable, low hardness
Designed for low-stress applications
Fiberglass-reinforced for puncture, shear and tear resistance
APPLICATIONS:
Power electronics DC/DC: 1/4, 1/2, full bricks, etc.
Mass storage devices
Graphics cards, processors and ASICs
Wireline/wireless communications hardware
Automotive engine and transmission controls