BERGQUIST® GAP PAD® TGP 1500R

BERGQUIST® GAP PAD® TGP 1500R has the same highly conformable, low-modulus polymer as the standard BERGQUIST® GAP PAD® TGP 1500. The
fiberglass reinforcement allows for easy material handling and enhances puncture, shear and tear resistance. The natural tack on both sides of the material allows for
good compliance to mating surfaces of components, further reducing thermal resistance.
FEATURES:
Thermal conductivity: 1.5 W/m-K
Fiberglass-reinforced for puncture, shear and tear resistance
Easy release construction
Electrically isolating
APPLICATIONS:
Telecommunications
Computers and peripherals
Power conversion
Memory modules / chip scale packages
Areas where heat needs to be transferred to a frame chassis or other type of heat spreader