3M™ Thermally Conductive Silicone Interface Pad 5591

3M™ Thermally Conductive Silicone Interface Pad 5591 is designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. 3M™ Thermally Conductive Silicone Interface Pad 5591 consists of a highly conformable and slightly tacky silicone elastomer sheet filled with thermally conductive ceramic particles, which helps provides enhanced thermal conductivity and excellent electrical insulation performance.
FEATURES
Very good softness and conformability even to non-flat surfaces
Good thermal conductivity
Good electrical insulation properties
Compression relaxation properties help reduce pressure to electric components
Slight tack allows pre-assembly
Good wettability for improved and lower thermal resistance
APPLICATIONS
Integrated chip (IC) packaging heat conduction
Heat sink interface
Chip on film (COF) heat conduction
LED board thermal interface material (TIM)
HDTV integrated chip (IC)
General gap filling in electronic device