3M™ Thermally Conductive Interface Pad 5595

3M™ Thermally Conductive Interface Pad 5595 is  designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices.
FEATURES
Provides for good thermal stability of the base polymer with excellent softness of the thermal pad.
Offers good thermal conductivity in a soft silicone polymer base.
The product tack is such that a mechanical means to support the pad in a final assembly is required.
APPLICATIONS
3M™ Thermally Conductive Interface Thermal Pad 5595 is designed to provide a preferential heat-transfer path between heat-generating and cooling devices (e.g., fans, heat pipes and heat sinks).