TIS420C 1K Thermally Conductive Gap Filler

TIS420C is a one-component thermally conductive Gap Filler and cures at room temperature to become a mechanically stable silicone gel. Due to its curing performance, TIS420C provides improved stability in 3- dimensional and vertical TIM applications that require a stress-absorbing, pump-out resistant, mechanically stable, and repairable heat path.
FEATURES:
1 component system
High thermal conductivity
Physical stability due to polymerization during cure
Soft, stress-absorbing post-cure properties
Conforms to intricate shapes & component designs
Use within a broad operating temperature range
Repairable
APPLICATIONS:
Gap filler
Thermally Conductive Management