TG-996-3 Ultra Soft Thermal Conductive Pad

TG-996-3 is an ultra-soft, silicone thermal pad, suitable for use as thermal interface material or heat sink to dissipate the heat from electronic devices, especially in integrated circuit (IC) and LED packaging.
FEATURES
Low thermal impedance, good surface compliance, high dielectric breakdown voltage,
very low hardness and elasticity, high thermal conductivity, good high temperature
resistance and good electrical insulation.
Wide range of formats ranging from custom
die cut parts to standard sheets in a range of thicknesses depending on the end
application.
APPLICATIONS
Soft silicone based thermal interface material or heat sink to dissipate the heat from
electronic devices, especially in integrated circuit (IC) devices and LED packaging.