LIPOLY H-putty Thermal Conductive Putty

LiPOLY H-putty is a one-part dispensable material with thermal conductivity 3.5 W/m*K. High deforma- tion can fill small air gaps perfectly to remove tolerance. It also can overcome overflow and drying problems to increase the thermal conductivity. H -putty is a great alternative to thermal grease and ideally suited for dispensing using the dispensing robot.
FEATURE
Thermal conductivity:3.5 W/m*K
Bond line thickness:100-3000µm
Designed to remove manufacturing tolerances
Does not produce stress on delicate components
No vertical flow
Dispensable for serial manufacture
For any high compression and low stress application
APPLICATION
Between CPU and heat sink
Between a component and heat sink
High speed mass storage drives
Telecommunication hardware
Flat-panel displays
Set-top box
IP CAM
5G base station & infrastructure
EV electric vehicle