JONES Thermal PAD 21-233-300-0816

JONES Thermal Pad 21-233 is designed to provide good thermal performance and adhesion or natural tack. It demonstrates highly conformable to uneven and rough surfaces with minimal thermal gap filler compression. JONES Thermal Pad 21-233 is available in custom die-cut parts, sheets, and rolls, which makes it easy to handle and simplifies application. It’s also available in a variety of thicknesses and hardness.
FEATURE
Thermal Conductivity: 3.0W/m·K
Very Good Thermal Performance
Good Compressibility and Elasticity
Tiny Outgassing
Designed For the Smartphone Industry
Easy For Installation
APPLICATION
Memory Modules
Mass Storage Devices
Automotive Electronics
Telecommunication Hardware
Radios
Power Electronics