JONES TECH Thermal Gel 21-335

21-335 Series is Two-Part Thermal Gel with low viscosity, silicone putty thermal gap filler in which is cured in room temperature. It is designed to be used where large gap tolerances are present and low mechanical stress on delicate components are needed. It is ideal for filling variable gaps between multiple components and a common heat sink.
Key Features
Extreme Low stress induced during assembly
Easy for rework
Easily dispensable
Cured in room Temperature
Electrically Isolating
Low Thermal Resistance
Applications
Smart device/phone
Cooling components to chassis, frame, or other mating components
Memory modules
Home & Small Office Network
Mass Storage Devices
Automotive Electronics
Telecommunication Hardware
Radios
LED Solid State Lighting
Power Electronics
Set Top Boxes
Audio & Video Component
IT infrastructure
GPS navigation and other portable
devices