Jones Tech JONES 21-725 Thermal Phase Change Material

FEATURES AND BENEFITS
APPLICATIONS OF JONES 21-725
JONES 21-725, phase change interface thermal material, is designed to maximize heat sink performance and improve component reliability. It minimizes thermal resistance at interfaces and maintains excellent performance when it fills interfacial gaps and voids.
At room temperature, JONES PCM 21-725 is solid and easy to handle. This allows it to be consistently and cleanly applied as dry pad to a heat sink or component surface. Upon reaching its softening temperature of ~50 °C,PCM 21-725 begins to soften and Gow, filling the microscopic irregularities of the component. The result is an interface with minimal bond-line thickness and thermal contact resistance.
FEATURES AND BENEFITS
Low Thermal Resistance｜Phase Change ~50 °C｜Excellent Interface Wetability｜High Reliability｜RoHS Compliant｜Form: Pad
APPLICATIONS OF JONES 21-725
CPUs (Notebooks,Desktops, Servers)｜ Chipsets｜GPUs｜ASICS Chips.
ABOUT PROSTECH
Vật tư Sunflower provides specialized manufacturing and bonding solutions for a wide range of industries, serving as an authorized distributor of leading global manufacturers of industrial materials and equipment. Our product range is focused and in-depth, with the aim of delivering “customized” solutions tailored to each customer’s specific applications and needs. Browse our full selection of products
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Testing sample quality and verifying product compatibility in our laboratory
Providing expert advice on suitable equipment and automation processes
Customizing material formulas to meet special application requirements
Customizing product sizes, quantities, and packaging according to customer needs
Offering technical training and on-site support to ensure optimal use of our products
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