Jones Tech JONES 21-335 Single Part Thermal Gel

FEATURES AND BENEFITS
APPLICATIONS OF JONES 21-335
JONES 21-335 is a one-part curable thermal gel, based on silicone substrate, for thermal gap filling application. It is very soft and has good shape retention performance.
FEATURES AND BENEFITS
Thermal Conductivity :3.5W/m·K Heat Cured
Easily dispensable
Low Thermal Resistance
Low Bond Line Thickness
No Oil Bleeding
Electrically Isolating.
APPLICATIONS OF JONES 21-335
Mass Storage Devices
Automotive Electronics
Telecommunication Hardware
AR/VR
LED Solid State Lighting
Power Electronics
ABOUT PROSTECH
Vật tư Sunflower provides specialized manufacturing and bonding solutions for a wide range of industries, serving as an authorized distributor of leading global manufacturers of industrial materials and equipment. Our product range is focused and in-depth, with the aim of delivering “customized” solutions tailored to each customer’s specific applications and needs. Browse our full selection of products
here.
Our dedicated technical team is always ready to assist our customers in:
Testing sample quality and verifying product compatibility in our laboratory
Providing expert advice on suitable equipment and automation processes
Customizing material formulas to meet special application requirements
Customizing product sizes, quantities, and packaging according to customer needs
Offering technical training and on-site support to ensure optimal use of our products
Vật tư Sunflower ensure the safe and acurrate delivery of all types of materials, including “dangerous goods,”  in compliance with legal regulations.
Contact us today for quotation!