JONES 21-430 Thermal Grease

JONES Thermal Grease 21-430 is a silicone based, high performance thermal interface material. It is designed to perform high thermal conductivity between high watt density chips like CPUs, GPUs, ASIC, Northbridge chipsets and heat sink. It demonstrates outstanding thermal performance and high reliability while wetting out the thermal interfaces under assembly pressure.
FEATURES AND BENEFITS
Thermal Conductivity: 3.3W/m·k｜ Moderate Viscosity For Easy Application｜ No post “Cure” required｜High Thermal Conductivity｜No Dry Out @150°C｜ Solvent-free.
APPLICATIONS
CPUs (Notebooks, PCs, Servers)｜LED Solid State Lighting｜GPUs｜Northbridge Chipsets｜ASICS Chips.