High Conductivity TC1050* Heat Spreader

TC1050 heat spreader consists of a TPG* core encapsulated within a structural shell. The TPG provides a highly conductive path while the encapsulation material provides the structure (strength, stiffness, and coefficient of thermal expansion). Common Encapsulation Materials include:
– Aluminum (TC1050.AL)
– Copper (TC1050.CU)
– Other available encapsulations and systems include Kovar, WCu, MoCu, AlSiC, stainless steel, Ni, carbon fiber, etc.
FEATURES:
Thermal conductivity 5x of aluminum and 3x of copper
Low thermal interface resistance
Lighter than aluminum
Adjustable coefficient of thermal expansion
Wide operating temperature range
Mechanical load bearing
Hermeticity higher than 10-8 atm.cc/s
Vibration and shock resistance
Machinable
Platable
Size up to 4 ft2 (0.37 m2)
APPLICATIONS:
Heat spreader in electronic packaging
Thermal cores for PWB’s
Finned heat sinks
Avionic thermal cores
Satellite traveling wave tube (TWT) mounts
Electronic chassis
Cold plates in radar systems