Epoxy for Optoelectronic Devices Potting and Bonding

JB007-1 is epoxy resin for optoelectronic devices. This resin has good operability, excellent surface gloss after curing, and good resistance to chemicals. Due to its rapid cured at low temperature, this product has two characteristics of application method and rapid cured. It is a widely used epoxy resin.
Key Features
The hardener of this product which is exposure in air will not yield an insoluble, whitish solid.
It offers excellent retention of electrical insulation properties under high humidity conditions.
The resin cures rapidly at room temperature.
The hardening surface will not exhibit poor gloss.
This product complies with the 2011/65/EU RoHS regulations.
Applications
This product can be applied to infusion of metal and plastic. This resin can completely seal the electronic parts in the insulating container. This product has excellent durability and can pass many different environmental tests.