BERGQUIST® TGR 4000 – Thermal Interface Compound for Copper-Based Heat Sinks

BERGQUIST® TGR 4000 is a thermally conductive grease compound designed for use as a thermal interface material between a computer processor and a copper-based heat sink. Other high watt density applications will benefit from the extremely low thermal impedance of BERGQUIST® TGR 4000.
FEATURES:
• Thermal conductivity: 4.0 W/m-K
• Exceptional thermal performance:
0.19°C/W (at 50 psi)
APPLICATIONS:
• High performance computer processors (traditional screw fastening or clamping methods will provide adequate force to optimize the thermal performance of BERGQUIST® TGR 4000)
• High watt density applications where the lowest thermal resistance interface is required