TG6050 Ultra Soft Thermal Conductive Pad

TG6050 is an ultra-soft, silicone based thermal interface material. TG6050 has a low thermal impedance, conforms readily to surfaces due to its low hardness and provides a high dielectric breakdown voltage. TG6050 can be provided in various thicknesses and formats, such as custom die cuts, standard sheets or log rolls depending on the end application.
FEATURES
Superior thermal conductivity
Highly compressible
Naturally tacky
Low Shore 00 hardness
Low oil bleed
Electrically insulating
APPLICATIONS
Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink
LCD, TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.