TG4040F Ultra Soft Thermal Conductive Pad

TG4040F is an ultra-soft, silicone based thermal interface material with an additional fiber glass layer for ease of handling. TG4040F has a low thermal impedance, conforms readily to surfaces due to its low hardness and provides a high dielectric breakdown voltage. TG4040F can be provided in various thicknesses and formats, such as custom die cuts, standard sheets or log rolls depending on the end application.
FEATURES
Very good thermal conductivity
Compliancy, high compressibility
Fiberglass on one side
Non-deforming; High tensile strength
Electrical Insulation
Low oil bleed
APPLICATIONS
High Power Applications
Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink LCD, TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.