TG2030 Ultra Soft Thermal Conductive Pad

TG2030 is an ultra-soft, silicone based thermal interface material. TG2030 has a low thermal impedance, conforms readily to surfaces due to its low hardness and provides a high dielectric breakdown voltage. TG2030 can be provided in various thicknesses and formats, such as custom die cuts, standard sheets or log rolls depending on the end application.
FEATURES
Ultra-Soft and high compressibility
Naturally tacky
Low oil bleed
Electrically insulating
As a buffer in electronics
Decrease the defect rate of the electronics
APPLICATIONS
Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink LCD, TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.