t-Global Ultra Soft Thermal Pad PT-TG-3500F

By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
FEATURES:
Very good thermal conductivity
Fiberglass on one side
Non deforming
Electeical insulation
APPLICATION:
Best for high power applications
Electronic components: IC, CPU, MOS, LED, Mother Board, Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless
Hub, DDR ll Module, DVD Applications, Handset applications, etc.