Soder-Wick Rosin Flux Desoldering Braid 50-1-25

Soder-Wick Rosin Flux Desoldering Braid 50-1-25 offers the state of the art in desoldering technology. Soder-Wick® is designed for today’s heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick® responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage. All wick is sealed in nitrogen-purged packaged to avoid corrosion and loss of performance from moisture and oxygen.
FEATURES
Requires little or no post solder cleaning
No corrosive residues
Optimized construction for faster wicking and heat transfer
Halide free
Minimizes the risk of heat damage to components and circuit boards
APPLICATIONS
Thru-hole Components
SMT Pads and BGA Pads
Micro Circuits
Terminals
Lugs and Posts
Identification Script