Soder-Wick No Clean Desoldering Braid SW16055

Soder-Wick No Clean SW16055 is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick No Clean uses pure, oxygen free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity.
FEATURES:
Requires little or no post solder cleaning
No corrosive residues
Halide free
ESD Safe bobbins meet specs:
MIL-STD-1686C
MIL-HDBK-263B
Static decay provision of
MIL-B-81705C
Minimal risk of heat and static component damage
TYPICAL APPLICATIONS:
Soder-Wick No Clean SW16055 safely removes solder from:
Lugs and Posts
Micro Circuits
Surface Mount Device Pads
Ball Grid Array Pads