Shenmao PF684-S-20 SAC305 Sn/Ag3.0/Cu0.5 Lead-Free BGA Sphere (0.20mm)

Crafted from pure metals, our BGA Solder Spheres are meticulously developed to ensure precise alloy compositions for PBGA, CBGA, TBGA, CSP, and Flip Chip applications. Manufactured using Ultra Micron Technology with stringent quality control measures, these spheres guarantee high performance and reliability in your soldering projects.

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