Vật tư phòng sạch
PERMABOND® ES560 is a single-part epoxy adhesive which flows when heated. It is unfilled and selflevelling, making it particularly suitable for electronics potting and encapsulation applications, as well as underfilling and reworking microchips. It withstands thermal cycling and has excellent shock resistance.
FEATURES:
Excellent adhesive strength
Excellent resistance to vibration
Easy to use – no mixing required
Low viscosity
PERMABOND® ES560 single-part epoxy adhesive
PERMABOND® ES560 is a versatile single-part epoxy adhesive that becomes liquid when warmed. Ideal for electronics potting and encapsulation, it is unfilled, self-leveling, and perfect for underfilling and repairing microchips. This adhesive excels in thermal cycling, shock resistance, and provides reliable performance for various applications.
Danh mục: Permabond
Sản phẩm tương tự
Permabond
Permabond
Permabond