Momentive TIA241GF – 2 Part Gap Filler

TIA241GF is a 2-component, thermally conductive silicone material that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, its non-slumping pasty consistency provides physical stability to prevent run-off after dispense. TIA241GF can be used as a liquid dispensed alternative to pre-fabricated Thermal Pads, and as a Gap Filler for a broad array of thermal designs in electronic components.
FEATURES:
Good thermal conductivity
Fast, low-temperature cure
Retains softness after cure to contribute to stress relief
during thermal cycling
Easy to use 1:1 mixing ratio
Conforms to complex shapes of 3-dimensional interface
designs
Repairable
Flame retardant: UL94V-0 equivalent